JPH0564975B2 - - Google Patents
Info
- Publication number
- JPH0564975B2 JPH0564975B2 JP63272275A JP27227588A JPH0564975B2 JP H0564975 B2 JPH0564975 B2 JP H0564975B2 JP 63272275 A JP63272275 A JP 63272275A JP 27227588 A JP27227588 A JP 27227588A JP H0564975 B2 JPH0564975 B2 JP H0564975B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- aluminum hydroxide
- laminate
- impregnated
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 17
- 238000000465 moulding Methods 0.000 claims description 12
- 239000004745 nonwoven fabric Substances 0.000 claims description 12
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 239000011342 resin composition Substances 0.000 claims description 9
- 239000005011 phenolic resin Substances 0.000 claims description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- 239000002759 woven fabric Substances 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- 239000011188 CEM-1 Substances 0.000 description 3
- 101100257127 Caenorhabditis elegans sma-2 gene Proteins 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical compound ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011190 CEM-3 Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63272275A JPH02120330A (ja) | 1988-10-28 | 1988-10-28 | 積層板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63272275A JPH02120330A (ja) | 1988-10-28 | 1988-10-28 | 積層板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02120330A JPH02120330A (ja) | 1990-05-08 |
| JPH0564975B2 true JPH0564975B2 (en]) | 1993-09-16 |
Family
ID=17511581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63272275A Granted JPH02120330A (ja) | 1988-10-28 | 1988-10-28 | 積層板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02120330A (en]) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT395432B (de) * | 1990-06-13 | 1992-12-28 | Isovolta | Mit kunststoff impraegnierte matte sowie verfahren zu deren herstellung und ihre verwendung |
| AT396240B (de) * | 1990-06-13 | 1993-07-26 | Isovolta | Prepreg verfahren zu seiner herstellung und seine verwendung |
| US5849601A (en) | 1990-12-25 | 1998-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| IE80526B1 (en) * | 1994-02-10 | 1998-08-26 | Belfield Mfg Ltd | A process for producing limited fire hazard epoxide glass laminates |
| US6187852B1 (en) | 1996-03-22 | 2001-02-13 | Isola Laminate Systems Corp. | Fillers for improved epoxy laminates |
| JP6183743B2 (ja) * | 2013-05-29 | 2017-08-23 | パナソニックＩｐマネジメント株式会社 | プリプレグ、金属張積層板、プリント配線板 |
-
1988
- 1988-10-28 JP JP63272275A patent/JPH02120330A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02120330A (ja) | 1990-05-08 |
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